POP Test Solutions

Package on Package Mobile IC Test Solutions

High Speed LPDDR4 4266 Mbps


G3 PoP Socket
  • App. Standards: LPDDR3/4, up to 4266Mbps
  • Signal Paths: DDR pins, interposer(DDR shift)
  • Test configure: EVB manual, FT(ATE), SLT
G2 PoP Socket
  • App. Standards: LPDDR2/3, up to 2133Mbps
  • Signal Paths: DDR pins, interposer(DDR shift)
  • Test configure: EVB manual, FT(ATE), SLT
G1 PoP Socket
  • App. Standards: LPDDR2/3, up to 1600Mbps
  • Signal Paths: DDR pins, interposer, long pins,
    Load board traces.
  • Test configure: EVB manual, FT(ATE), SLT
Mechanical Design
  • Novel Vacuum Chamber Design Concept
    more than 80% vacuuming performance
  • Golden DDR Module Protection
    over 200k insertion times
  • Highly Integrity Design for EVB/FT/SLT
    fully compatible for manual and ATE types
  • High electrical Performance for LPDDR4
    4266 Mbps high speed application
DUT Socket DDR Housing Cover Overall G3 PoP Socket
Signal Integrity

Signal Integrated results are base on the simulation flow as shown as above plot. IBIS models are customized and released from customers for simulation setting as TX/RX.

Pogo pins and interposer board in socket are important signal channel paths for SI eye-diagram results. Therefore, wide-band and non-distortion model for the paths is required for SI analysis.

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